Custom multi-element titanium alloy sputtering targets cover compound and multi-element systems where the target's chemical composition is tailored to produce specific thin film properties. Unlike commercially available pure titanium or standard alloy targets, multi-element targets are produced to custom stoichiometries — enabling deposition of complex functional coatings with properties matched to the application.

Feinuotai coordinates multi-element target manufacturing — from alloy powder sourcing and blending through consolidation, sintering or melting and casting to final machining. Target composition, density and homogeneity are controlled per specification.

Common Compound Systems

The following compound and multi-element systems are commonly coordinated for PVD applications.

TiAl

Ti-Al (Titanium Aluminum)

Intermetallic TiAl and TiAl3 systems — used for high-temperature protective coatings. Composition specified in atomic percent (at.%) or weight percent (wt.%).

TiNi

Ti-Ni (Titanium Nickel)

Nitinol-based and Ti-Ni compound targets — for shape memory alloy thin films and smart coating applications.

TiZr

Ti-Zr (Titanium Zirconium)

Ti-Zr binary targets — for corrosion-resistant alloy thin films and high-temperature barrier coatings.

TiMo

Ti-Mo (Titanium Molybdenum)

Ti-Mo alloy targets — for high-temperature oxidation-resistant coatings and electrical contact layers.

TiW

Ti-W (Titanium Tungsten)

Ti-W compound targets — for hard, wear-resistant and thermally stable thin film coatings.

TiSi

Ti-Si (Titanium Silicon)

Ti-Si compound targets — for silicon-rich diffusion barrier coatings and electronic device applications.

Additional elements including Cr, Cu, Fe, V, Nb, Ta, Hf and others can be incorporated into multi-element targets per specification. Three-component and higher multi-element alloy systems are also coordinated.

Target Manufacturing Process

Custom multi-element alloy targets are produced through a coordinated manufacturing route that begins with elemental or alloyed powder sourcing. The typical production sequence includes powder blending to the target stoichiometry, consolidation by hot pressing, spark plasma sintering or vacuum melting and casting, followed by precision machining to the final target geometry.

Feinuotai does not produce targets in-house — we coordinate manufacturing through qualified partners specializing in alloy powder processing and target fabrication, while managing the full supply process from specification review through delivery.

PB

Powder Blending

Elemental or pre-alloyed powders blended to the required stoichiometry — verified for composition before consolidation.

CN

Consolidation

Hot pressing, spark plasma sintering or vacuum melting and casting — selected based on target composition and density requirement.

MC

Machining

Precision CNC machining to final target geometry — planar, cylindrical or custom shapes per drawing.

Composition & Quality Specifications

Composition ranges are coordinated per application. Actual composition and purity are confirmed on delivery documentation.

Multi-element target composition is specified by atomic percent (at.%) or weight percent (wt.%) — the selection depends on your thin film deposition process and measurement convention. Target density and microstructure are also controlled, with high-purity targets available for research and semiconductor applications.

Composition analysis, density measurement and microstructure verification documentation are provided with each target shipment. When backing plate bonding is included, bond integrity testing documentation is also coordinated.

Applications & Industries

SC

Semiconductor

High-k dielectric materials, barrier layers and compound thin films for advanced electronic device manufacturing.

CT

Coating Technology

Advanced multi-component PVD coatings — tailored wear, corrosion and thermal properties.

ES

Energy Storage

Battery electrode materials, thin film electrolytes and energy conversion component coatings.

RD

Research & Development

Prototype multi-element thin films for academic and industrial research — custom compositions available for project-specific requirements.

Frequently Asked Questions

What compositions can you make?

Ti-Al, Ti-Ni, Ti-Zr, Ti-Mo, Ti-W, Ti-Si and custom multi-element systems are all coordinated. Additional elements including Cr, Cu, Fe, V, Nb, Ta, Hf and others can be incorporated per requirement. Three-component and higher alloy systems are also available.

What is the typical production process?

Typical route: powder blending -> consolidation (hot press / cast / spark plasma sinter) -> machined to final shape. Elemental purity and final composition are verified before delivery.

How is composition specified?

Multi-element target composition is typically specified by atomic percent (at.%) or weight percent (wt.%). Please state your preferred convention when submitting an inquiry.

Request a Quotation for Custom Multi-Element Alloy Sputtering Targets

Tell us target composition (element percentages), geometry, dimensions, backing plate requirement and quantity. A target drawing or detailed specification is preferred.

Helpful details: Composition (at.% or wt.%), Geometry, Dimensions, Backing Plate, Quantity, Drawing

Send Inquiry

Related Products