Commercially pure (CP) titanium sputtering targets — Grade 1, 2, 3 and 4 — for physical vapor deposition (PVD) thin film deposition processes.
Pure (commercially pure, or CP) titanium sputtering targets are titanium materials used as the source cathode in physical vapor deposition (PVD) sputtering processes. The sputtering process bombards the target surface with inert gas plasma ions (typically argon), ejecting titanium atoms that deposit as a thin film on the substrate surface.
Feinuotai supplies CP titanium sputtering targets machined from Grade 1, 2, 3 and 4 titanium starting stock — available in planar (rectangular or circular), cylindrical, rotary and custom shapes. Target purity, density and surface finish are controlled to ensure consistent sputtering performance.
Grade selection drives impurity level and mechanical properties. Purity references are standard industry values — actual purity per target is confirmed on delivery documentation.
Commercially pure titanium grades contain low alloy additions, with Grade 1 through Grade 4 distinguished primarily by increasing oxygen content and corresponding increases in strength. Grade 2 is the most widely used general-purpose CP titanium for sputtering targets. Grade 1 offers the lowest oxygen content for applications where reduced impurity levels are critical, such as certain semiconductor manufacturing processes.
Lowest oxygen content — highest purity CP grade. Preferred for semiconductor and research applications where impurity levels must be minimized.
Most widely used CP titanium grade for sputtering targets. Good balance of purity, ductility and availability. Standard choice for general PVD coating.
Higher oxygen content — slightly stronger than Grade 2. Used where increased target mechanical strength is beneficial.
Highest oxygen content of CP grades — strongest and least ductile. Selected for high-power or high-stress sputtering conditions.
Reference purity range for Grade 1–4 sputtering targets is approximately 99.5% to 99.9% titanium by weight. Actual purity and impurity levels per target are confirmed on material documentation provided with shipment.
Planar, cylindrical, rotary or custom shapes — dimensions confirmed against your sputtering equipment specifications.
Rectangular or circular flat plate targets — the most common target geometry for magnetron sputtering systems. Dimensions match equipment cathode requirements.
Solid or hollow cylindrical targets for non-planar magnetron configurations. Diameter and length specified per equipment design.
Rotating cylindrical targets used in high-rate deposition systems. Longer target life through continuous surface rotation.
Custom geometries per equipment design — racetrack, oval, segmented or multi-piece configurations. Drawing-based manufacturing.
Note: Specific target dimensions (length, width, thickness, diameter) are driven by the customer's sputtering equipment cathode specifications and coating requirement. Please provide your equipment cathode dimensions or target drawing when submitting an inquiry.
Many sputtering systems require the target to be bonded to a backing plate (typically copper or aluminum) to improve thermal conductivity and cooling during sputtering operations. Backing plate bonding is a coordinated operation — Feinuotai manages the bonding process through qualified partners and verifies bond integrity before delivery.
Not every target application requires backing plate bonding. Bonding requirements depend on target geometry, sputtering power density and equipment cooling design. Please specify whether backing plate bonding is required when submitting your inquiry.
Target surface finish affects sputtering uniformity and target life. Standard machine-finished surfaces provide consistent performance for most applications. Polished or mirror-finish surfaces are available for applications requiring enhanced performance or surface-sensitive processes. Please specify your surface finish requirement when submitting an inquiry.
Titanium and titanium nitride thin film deposition for diffusion barriers, contact layers and interconnect structures.
Titanium nitride (TiN), titanium oxide and elemental titanium PVD coatings for wear and corrosion resistance.
Gold-colored TiN decorative PVD coatings for consumer goods and hardware.
Titanium thin films for electronic device manufacturing and magnetic recording media.
Purity analysis, target density measurement and machining dimensional reports are available with each target shipment. When backing plate bonding is included, bond integrity testing documentation is also provided. Actual test reports depend on grade, target configuration and specific documentation requirements.
Grade 2 is the most widely used CP titanium for general PVD applications. Grade 1 and higher-purity variants are selected where reduced impurity content is critical, such as in semiconductor manufacturing.
Yes — Feinuotai coordinates titanium targets bonded to copper or aluminum backing plates for improved thermal conductivity during sputtering. Bonding process and backing plate material are confirmed per target application.
Planar (rectangular or circular), cylindrical, rotary and custom shapes are all available. Target geometry is specified against your sputtering equipment cathode design. Please provide your equipment cathode dimensions or target drawing when submitting an inquiry.
Tell us target geometry, dimensions, CP titanium grade (Grade 1/2/3/4), backing plate requirement and quantity. Include your sputtering equipment cathode dimensions or target drawing where applicable.
Helpful details: Target Geometry, Dimensions, Grade (1/2/3/4), Backing Plate Requirement, Quantity
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